AV & Presentation | News
TI DLP Releases New Chipset with Enhanced Interoperability, 3D, and Interactive Capabilities
Texas Instruments DLP has unveiled a new family of image-processing chips for front projectors that will enable broader standardization of 3D and interactive technologies. Projectors with the new chipset design will be able to display content from common 3D formats supported by HDMI 1.4 from virtually any mobile device, including tablets, smartphones, laptops, and Blu-ray players. The company expects the new chips to be incorporated into projectors starting in late summer.
A major benefit of the new chipset is that it allows projectors to work with any standard input format as well as any light source, at the full spectrum of resolutions, including XGA, SVGA, WXGA, 1080p and WUXGA. "Creating a chipset that makes 3D and interactive technologies more accessible for projector developers is a major step forward for the industry," said Roger Carver, general manager of DLP front projection, in a prepared statement. "This helps our customers build off-the-shelf projectors while adding new capabilities at a comparable price point."
The new chipset also facilitates the shift to lamp-free light sources by incorporating features designed specifically for solid-state deployment, enabling a wider range of manufacturing options. "The display industry has evolved beyond the days of the higher resolution chase and the brightness battles," added Carver. "As projectors increasingly become the central hub of the classroom, this new chipset will help optimize hardware and software for the new frontiers of interoperability, 3D, and interactive display."
Ease of connectivity and deployment are other advantages of the new chipset, allowing educators to run downloadable content from a laptop, tablet, or other mobile device, while still supporting standard formats such as Blu-ray and DVD.
About the Author
Andrew Barbour is the former executive editor of Campus Technology.